Hardback (31 Dec 1997)
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The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
| ISBN: | 9780780339293 |
| Publisher: | Institute of Electrical and Electronics Engineers |
| Imprint: | Institute of Electrical and Electronics Engineers |
| Pub date: | 31 Dec 1997 |
| DEWEY: | 621.381 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 482 |
| Weight: | -1g |
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